XT-XINTE Silicon Carbide Ceramic Heatsink Cooling for Electronic IC MOS Chip with Thermal Conductive Tape

Product description:    

Brand: XT-XINTE

Gray

Specifications: 5 or 10 units (optional)

STYLE: normal adhesive type, corrugated adhesive type (optional).

Please note that all wavy adhesive models are 5 units. There are 5 and 10 unit options for the normal sticker models.

Features:

Material: Silicon Carbide

Thermal conductivity: 10 W / MK average

The effect of the product:

1. Heat radiation effect

Based on the characteristics of the ceramic material itself that does not accumulate heat, after continuous testing and research, a ceramic heat sink with a microporous structure has been developed, which can have 30% more porosity under the same unit of area, and the same surface area can be much larger than the surface area of the dense surface material.

2. Effect of thermal convection

Due to the microporous structure, the surface of the ceramic heat sink is about 30% more porous than that of the metal heat sink, so it has a larger contact area with the convection medium air, which can carry more in the same unit of time as heat.

3. Uses the characteristics of ceramic materials to achieve heat dissipation efficiency.

Area of application:

Suitable for IC, MOS, triode, IGBT, heat pipe micro radiator, decoder equipment, communication hardware, power supply devices, etc.

Products include:

Silicon Carbide Ceramic Heat Sink x 5pcs or 10pcs. (optional)