XT-XINTE NVME NGFF M.2 2280 PCIE SSD Cooling Composite Silver-containing Carbonized Alloy Heat Sink Thermal Pad Heat Dissipation Radiator Insulating Cooler Case Support for PC Notebook

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XT-XINTE NVME NGFF M.2 2280 PCIE SSD Cooling Composite Silver-containing Carbonized Alloy Heat Sink Thermal Pad Heat Dissipation Radiator Insulating Cooler Case Support for PC Notebook Item NO: F31205 F31206

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For Notebook For Desktop PC
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Product Name XT-XINTE NVME NGFF M.2 2280 PCIE SSD Cooling Composite Silver-containing Carbonized Alloy Heat Sink Thermal Pad Heat Dissipation Radiator Insulating Cooler Case Support for PC Notebook
Item NO F31205 F31206
Weight 0.0350 kg = 0.0772 lb = 1.2346 oz
Category Consumer Electronics > Computer Cable and Adapter
Brand XT-XINTE
Creation time 2019-09-07

XT-XINTE NVME NGFF M.2 2280 PCIE SSD Cooling Composite Silver-containing Carbonized Alloy Heat Sink Thermal Pad Heat Dissipation Radiator Insulating Cooler Case Support for PC Notebook


Specifications:
Material: composite silver-containing carbonized alloy
Surface: inner layer silver plating + outer layer oxide sandblasting
Main heat sink thickness specification(For Desktop PC): 70 mm*23mm*7mm
Main heat sink thin specification(For Notebook): 70mm*23mm*2.5mm
Lower layer specification: 70mm*24mm*1mm
Heat sink instantaneous peak thermal conductivity: 560W/mk
Interlayer thermal conductive material: nano-super soft non-fluid thermal Silica gel
Thermal pad instantaneous peak thermal conductivity: 8W/mk

The front and back sides can simultaneously dissipate heat
Subverting traditional thermal conductivity: Carbonized alloys are hard and wear-resistant hexagonal crystals with good strength and higher thermal conductivity than conventional aluminum. The surface nano-layer increases the contact surface with the air, accelerates the exchange of heat, and has a high-grade appearance.

Thermal conductivity comparison:
Silver plated + carbonized alloy: 560W/mk
Sterling silver: 429W/mk
Pure copper: 401W/mk
Pure aluminum: 237W/mk


The high-purity nano thermal pad has a delicate and soft property, and when pressed, it will squeezing to the gap of each chip, bringing unexpected thermal conductivity. Bonding strength: 0.3kg/inch
Thermal conductivity: 8W/mk
Adapt to temperature: -20 ° C ~ 120 ° C

installation steps:
1. Peel the protective film of M.2 thermal silica gel and stick it on the bottom of the heat sink.
2. Insert the solid state drive into the heat sink slowly along the card slot.
3. After tearing off the protective film of M.2 thermal silica gel, stick it on the hard disk, and insert the top heat sink into the card slot of the bottom heat sink along the card slot.

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